Numerous tests and measurements are performed on all lots to ensure consistent high quality. All etch cuts are tested in real-time on all boards. All etch cuts, added traces, and proximity locations are electrically tested as the lot is processed. Termination pad overlap must be at least .002 inches. Minimum trace width is verified to be .008 inches and minimum distance to a solderable surface is .006 inches. Overall trace height (thickness) is verified to be less than .004 inches (can vary by .001 inch, depending on topography and other factors).