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Design Guidelines

Additive Circuitry Modification (ACM) Technology is a proprietary process which utilizes solid copper conductor technology to achieve ECOs on existing prin ted circuit boards. This process involves the addition of circuit traces to one or both sides of the PCB by processing another circuit layer on the board. Selec tive deposition of an isolation layer and a conductive trace layer is used when required by the customer The isolation layer acts as an insulator between conduc tors, and the solid copper layer forms the circuit. The following guidelines have been established to provide consistency to the ACM process. However, these are not limitations, as Additive Circuits, Inc. is continually advancing this t echnology to provide its customers with the highest quality service possible.

Line width:

* Standard: .018 in. / .015/ .012/ .010
* Minimum: .006 in.
* Standard line width will be used wherever practical.
* Note: Line widths are artwork apertures. Actual finished trace widths are typically +/- .002-.004 in.

Line spacing:

* From edge of PCB: .015 in. min.
* Between parallel lines: .015 in. min. for a max. .7 in. length. For parallel lines greater than 0.7 in. a jog in one of the line s is suggested.
* From any solderable surface: .006 in. min., .015 in. desired.

Line characteristics:

* All bends will be 45 deg., if possible; 90 deg. bends will be avoided. Crossovers of power or ground will be made at 90 deg. wherever possible. A minimum clearance of .005 in. should be maintained under components (where lines run under them). Length of timing lines will be determined by the user based on the process characteristics.

Fine pitch surface mount applications:

* Surface mount stencils should be modified with a "half etch" to create a cavity that accommodates the added traces. An artwork layer will be provided to your stencil maker.


* Long, narrow conductor traces should be avoided wherever possible especially in high current paths (more than 1 amp). such as Vcc and ground.


* Interconnects can be made to any solderable surface. Interconnects must have a minimum .002 in. overlap. Interconnects and pads for surface mounted components can be accomplished as long as other guidelines are followed.

Trace Cuts:

* Surface trace cuts and internal trace cuts can be accommodated. Pad isolations can be easily achieved.

Insulation resistance:

* The isolation layer used in the process has an insulation resistance on the order of 1013 ohms and has a dielectric strength on the order of 1000 volts/mil. Typical epoxy thickness is .001 +/- .0003 in.

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