The Additive process maintains board integrity, flexibilty, and manufacturability with six primary process steps.
1. CAD
Design - CAD data is downloaded and an optimal ECO routing is created.
2.
Trace Cuts - traces are deleted and designated
pads are isolated, including inner layers. 3.
Protective layer - a protective epoxy is
applied. This layer creates a known surface and masks the customer's
circuitry. It also compensates for possible breaks in the customer's
solder mask, and coats other surfaces in the event that the new
circuitry runs adjacent to existing vias or solderable surfaces. 4.
Solid Copper- 1 oz. electrodeposited (ED)
copper conforms to IPC-4562 5.
Solder Ink - terminations selectively soldered
with assembly compatible paste. Compatible no-lead solder used for RoHS
compliance. 6.
Test/Certification - new circuitry is carefully tested to ensure its
compliance with specifications. 7.
Final Line Mask - a protective polymer provides additional stability to
the completed process.